This international technology assessment study has focused on the emerging global trend toward the miniaturization of manufacturing processes, equipment and systems for microscale components and products. The study has investigated both the state-of-the-art as well as emerging technologies from the scientific, technological, and commercialization perspectives across key industrial sectors in the USA, Asia and Europe.

InhaltsangabeForeword; Table of Contents; List of Figures; List of Tables; Executive Summary; 1. Introduction: Richard E. DeVor and Kornel F. Ehmann: Background and Scope; Methodology; Overview of the Report; Format for this Report; Acknowledgements; 2. Design: Martin L. Culpepper and Thomas R. Kurfess; Abstract; The Approach Taken to Assess the State-of-the-Art in NLBMM Design; Unique Requirements for the Design of NLBMM Parts, Processes and Equipment; The Design Process and the Important Elements ofDesign of Y for NLBMM Products; The State-of-the-Art and Gaps between Existing and Required Capabilities; Summary and Conclusions; References; 3. Materials: David Bourell and Kamlakar Rajurkar: Abstract; Materials for Micromanufacturing; Materials Issues in Micromanufacturing; Summary and Conclusions; References; 4. Processes: Kamlakar Rajurkar and Marc Madou: Abstract; Micromanufacturing Processes and Equipment; Micromanufacturing Issues; Summary and Conclusions; References; 5. Metrology, Sensors and Control: Thomas R. Kurfess and Thom J. Hodgson: Abstract; Introduction; Summary and Conclusions; References; 6. Non-lithography Applications: Marc Madou: Abstract; Applications ofNon-lithography Machining; Flexible Manufacturing and Desktop Manufacturing; MEMS Foundry; Summary; References; 7. Business, Education, the Environment, and Other Issues: Thom J. Hodgson: Abstract; Business; Education; Environment; Government Policies; APPENDICES: A. Panelist Biographies; B. Questionnaire for Site Visits; C. Site Reports-Asia: National Institute ofAdvanced Industrial Science and Technology (AIST); Asia Pacific Microsystems, Inc. (APM); FANUC, FA&Robot; Hitachi Chemical R&D Center in Tsukuba; ITRI - Mechanical Industry Research Laboratories (MIRL); ITRI - Nano Technology Research Center (NTRC); Instrument Technology Research Center (ITRC); Korean Advanced Institute of Science and Technology (KAIST); Korean Institute ofMachinery and Materials (KJMM); Kyocera Corporation; Kyoto University; Matsuura Machinery Corporation; Metal Industries Research and Development Centre (MTRDC); Mitsubishi Electric Corporation (MEC); Nagoya University - Center for Cooperative Research in Advanced Science; Nagoya University - Laboratory of Structure and Morphology Control; Nagoya University - Department of Micro System Engineering; National Cheng Kung University; National Science Council; National Taiwan University; Olympus Corporate R&D Center; RIKEN (The Institute of Physical & Chemical Research); Samsung Electro Mechanics Corp., R&D Center; Sankyo Seiki; Sansyu Finetool Co., Ltd; Seiko Instruments Inc. (511); Seoul National University; University of Electro Communications; University of Tokyo; I. I. S., The University of Tokyo;Yonsei University; D. Site Reports-Europe: BASELWORLD; Robert Bosch, GmbH; Ecole Polytechnique Fédérale De Lausanne (EPFL); Fraunhofer Institute - Manufacturing Engineering and Automation (IPA); Fraunhofer Institute - Production Systems and Design Technology (IPK); Fraunhofer Institute - Production and Laser Technology (IPT)/(ILT); Fraunhofer Institute - Reliability and Microintegration (IZM); Karlsruhe Research Center; Kiocke Nanotechnik; Kugler GmbH; Laser Zentrum Hamiover e.V; Institut für Mikrotechnik Mainz GmbH (1MM); Philips Center for Industrial Technology (CFT); Swiss Federal Institute ofTechnology - Zurich (ETHZ); Technical University of Eindhoven; Carl Zeiss Industrielle Messtechnik, GmbH; Zumtobel;E. Glossary.